News
AFM-Based Protocol for Characterizing the Incipient Stages of Plasticity on Hybrid Bonding-Ready Copper Pads (NIST, Intel, Colorado School of Mines)
3+ hour, 53+ min ago (300+ words) A new technical paper titled "Probing the Nanoscale Onset of Plasticity in Electroplated Copper for Hybrid Bonding Structures via Multimodal Atomic Force Microscopy" was published by researchers at the National Institute of Standards and Technology, Intel, and Colorado School of…...
Benefits And Limits Of Using ML For Materials Discovery
5+ day, 16+ hour ago (633+ words) Humans are still necessary, and no tool does everything, but the potential is significant. Machine learning tools can accelerate all stages of materials discovery, from initial screening to process development. Whether the goal is to identify new applications for known…...
Role of Elastomer Structure in Blending Strategy for Stretchable Semiconducting Thin Films (CAS, RIKEN)
3+ week, 1+ hour ago (153+ words) A new technical report titled "Polymer semiconductor blends with remarkably stable semiconducting performance under large and cyclic mechanical deformation" was published by Chinese Academy of Sciences (CAS) and RIKEN Center for Sustainable Resource Science. The paper states: "We report deformable…...
Scalable Fabrication of Nano-OLEDs Smaller Than The Defraction Limit (ETH Zurich et al.)
3+ week, 7+ hour ago (148+ words) A technical paper titled "Scalable nanopatterning of organic light-emitting diodes beyond the diffraction limit" was published by researchers at ETH Zurich, University of Alberta, Indian Institute of Science (IISc) and Huazhong University of Science and Technology. Abstract: "Miniaturization of light-emitting…...
Machine Learning Tools Accelerate Materials Discovery
1+ mon, 3+ day ago (435+ words) But only if the data is in a format and context that machines can understand. Literature searches, simulations, and practical experiments have been part of the materials science toolkit for decades, but the last few years have seen an explosion…...
Mitigating Structural Defects During The Growth Of 2D vdW Chalcogenides By MBE (Penn State Univ.)
1+ mon, 6+ day ago (261+ words) A new technical paper titled "Mitigation of Structural Defects during the Growth of 2D van der Waals Chalcogenides by Molecular Beam Epitaxy" was published by researchers at Penn State University. Abstract "The growth of wafer-scale van der Waals (vdW) thin films…...
First Stage Of Nanoscale Imaging In Positive-Tone EUV Photoresists: The Impact Of Polymer Sequence (Berkeley Lab, Columbia Hill)
2+ mon, 2+ week ago (93+ words) A new technical paper titled "Initial stage of nanoscale imaging in positive-tone extreme UV photoresists: the influence of polymer sequence" was published by researchers at Lawrence Berkeley National Laboratory and Columbia Hill Technical Consulting. Abstract "Photolithographic patterning using extreme ultraviolet…...
Breaking The Copper Bottleneck With Molybdenum Hybrid Metallization
3+ mon, 5+ day ago (696+ words) A promising alternative to conventional copper dual damascene reduces total via/line resistance by about 55%. Hybrid metallization is a new technique that uses bottom-up deposition to prefill a via with barrierless metals. Barrierless metals are metal interconnects that do not…...
Electrochemical Absorption of Hydrogen in Structured Palladium Thin-Film Electrodes (Univ. of Bristol)
3+ mon, 3+ week ago (305+ words) A new technical paper titled "Exploring Electrochemical Methods for Precision Stress Control in Nanoscale Devices " was published by researchers at the University of Bristol. Abstract "Tuning the local film stress (and associated strain) provides a universal route toward exerting dynamic…...
The End Of Copper Interconnects?
4+ mon, 2+ day ago (478+ words) Ruthenium plays a key role at advanced nodes, but it's not a wholesale replacement. After nearly three decades, the era of copper interconnects may be coming to an end. Sort of. At interconnect CDs below 10nm, copper is no longer the…...